Article

Non-destructive Depth Profiling of Multilayer Films Utilizing XPS/HAXPES

Surface Analysis Spotlight: XPS

by Amy Ferryman Analytical Lab and Marketing Manager

X-ray photoelectron spectroscopy (XPS) has long been preferred for its precision and reliability in discerning nanometer thick films on silicon substrates. However, challenges arise when using surface sensitive soft X-ray sources, as the areas of interest are often concealed beneath capping or oxide layers. Higher energy X-ray beams facilitate the detection of photoelectron signals from deeper layers, but historically, most of this analysis has been conducted at synchrotron radiation facilities. Recent advancements in laboratory-based hard X-ray photoelectron spectrometers (HAXPES), such as the PHI Genesis, have opened new avenues for routine examination of subsurface layers of technological devices.

In this poster, recent advancements in combined XPS/HAXPES laboratory instrumentation for investigating semiconductors, nanoelectronics, and energy storage devices are showcased. It also highlights the merging of angle resolved XPS and HAXPES data to assess thickness and composition of thin film structures using StrataPHI analysis software.