Article

Revolutionizing Thin Film Analysis: Non-Destructive Techniques for Advanced Technology Applications

Surface Analysis Spotlight: XPS

by Kateryna Artyushkova President

Thin films constitute essential components in integrated circuits, superconducting devices, and solar energy conversion systems, necessitating meticulously regulated thickness and uniform coverage to achieve optimal functionality.

Non-destructive characterization of multi-layered thin films is crucial within these advanced technological sectors.

This methodology entails the examination of the properties and architecture of thin films while preventing any form of damage, thereby preserving the integrity and operational efficacy of the materials involved.

Angle-dependent X-ray Photoelectron Spectroscopy (ADXPS) is a non-destructive method available on the PHI Genesis to ascertain oxide layer thickness, uniformity, and structure.  It can be used along with a higher energy hard X-ray source, in particularly Cr Kα, to study buried interfaces.

PHI has developed StrataPHI analysis software to reconstruct quantitative, non-destructive XPS/HAXPES depth profiles from angle-dependent and single-angle photoelectron spectra.

New StrataPHI capabilities allow for scientists and engineers in metrology and research & development to analyze multi-layered thin films and ultra-thin films rapidly and non-destructively without potentially damaging due to ion beam sputtering, that might otherwise be required to depth-profile or sputter-clean adventitious contamination off the surface.  The StrataPHI software also includes a fractional coverage analysis mode.

To learn more about the unique features of PHI XPS and thin film analysis, please attend the upcoming talk "Non-Destructive Characterization of Multi-Layered Thin Films Using XPS, HAXPES and Structure Modeling in StrataPHI", Dr. Kateryna Artyushkova at AVS 70 in Tampa, FL this November.