Event
From R&D to Manufacturing and Failure Analysis: Leveraging Surface Analysis for Material Breakthroughs
Presented by Dr. Norbert Biderman
Differing from the bulk properties of materials, surfaces and interfaces often hold the key to successful products in the market. The need to understand surface and interface behavior has driven the development of instruments and methods that provide surface-sensitive information distinct from the underlying bulk material - Auger electron spectroscopy (AES), time-of-flight-secondary ion mass spectrometry (TOF-SIMS), and X-ray photoelectron spectroscopy (XPS).
Uniquely positioned among analytical techniques, surface analysis has been applied to materials development, process control, and failure analysis to solve problems at every stage of the product development cycle. By characterizing surfaces or interfaces, researchers and engineers can unlock new materials and processes with enhanced properties, such as improved corrosion resistance, better adhesion, or increased durability. In process control, multiple samples are monitored using surface analysis tools to ensure conformity to specifications as well as adjust processing parameters to prevent subpar performance of finished products. Surface-based techniques, which might be overlooked by traditional techniques, also enable the identification of unknown materials that may be responsible for product failures.
Through several case studies, instrument manufacturer Physical Electronics (PHI) will showcase how state-of-the-art surface analysis instruments and analytical methods serve as pivotal tools in bringing technologies to market.
